Contributions should address physics and engineering aspects of the applications of superconductivity. Contributions are encouraged covering the whole spectrum of the field: from materials to applications, from established LTS materials to prospective HTS materials and from small-size to large scale. All submitted abstracts will be reviewed for scientific content and relevance by the Program Committees.
Online abstract submission is now open. Click here to submit.
The deadline for abstract submission is Monday 18 March 2019. Abstracts submitted post-deadline will only be considered at the discretion of the Program Chair.
Topics and subtopics for your abstract should be selected from the list of submission categories and provide enough information to correctly place your presentation in the conference program.
Oral and posters
When submitting an abstract, please specify your preference, either for an “oral” or “poster” contribution. The “I have been invited” selection is for those already in receipt of an invitation from the program committee.
A number of high quality submitted contributions will be elevated to the status of invited talk.
Notifications of acceptance or rejection of the abstract after review by the Programme Committee will be communicated to the authors by mid-May 2019.
Contact information is required for all authors. The person submitting the abstract need not be the presenting author. Every contribution needs to indicate which author will be the associated registered delegate at the conference. Each delegate may only take this role for one abstract.
EUCAS 2019 will lead to two separate publications for work presented at the conference: Journal of Physics: Conference Series (JPCS), a peer-reviewed, open-access journal from Institute of Physics Publishing (UK) and a Special Issue of Superconductor Science and Technology (SUST) which is an international, multidisciplinary journal on all aspects of superconductivity.
Details on publications and eligibility are available here.
On behalf of the Organising Committee and the Program Committee, we are looking forward to welcoming you to Glasgow in 2019.John Durrell and Robert Hadfield, Conference Co-Chairs
Damian Hampshire, International Program Committee Chair
Yifeng Yang, Large Scale Chair Susie Speller, Materials Chair
Paul Warburton, Electronics Chair Ed Romans, Publication Chair