Contributions should address physics and engineering aspects of the applications of superconductivity. Contributions are encouraged covering the whole spectrum of the field: from materials to applications, from established LTS materials to prospective HTS materials and from small-size to large scale. All submitted abstracts will be reviewed for scientific content and relevance by the Program Committees.
Online abstract submission is now open. Click here to submit your 150 word abstract.
The deadline for abstract submission is Monday 18 March 2019. Abstracts submitted post-deadline will only be considered at the discretion of the Program Chair.
Topics and subtopics for your abstract should be selected from the list of submission categories (shown below) and provide enough information to correctly place your presentation in the conference programme.
11 Wires and Tapes
11.1 Nb based composites
11.2 MgB2 wires and Tapes
11.3 Bi-Oxides wires and tapes
11.4 Coated conductors
12.1 Metals, alloys and simple compounds
12.2 Cuprates and related materials
12.3 Fe-Based materials
12.4 Thin Films, artificial structures, multilayers (including buffer layers, templates…)
12.5 Other Materials including Novel Materials
13.1 Basic properties (Critical Fields, Critical Temperature….)
13.2 Mechanical properties, strain sensitivity, thermal properties
13.3 Magnetization and AC loss
13.4 Critical Current and Flux pinning
13.5 Other properties
13.6 Measurement techniques
2 Large Scale
21 Superconducting magnets
21.1 Accelerator magnets and cables
21.2 Fusion magnets and cables
21.3 Detector magnets and cables
21.4 High field, NMR magnets and cables
21.5 HTS magnets and cables
22 Electric Power Applications
22.1 Motors, Generators and other rotating machines
22.2 Power transmission lines and cables
22.3 Transformers, SMES and Fault Current limiters
23 Other Large Size Applications
23.1 Superconducting RF
23.2 Levitation, Transportation and Propulsion
23.3 Magnetic Separation and other Applications
23.4 MRI and Medical Applications
24 Design, Ancillaries and Technology
24.1 Current leads
24.2 Quench and Protection
24.3 Stability and AC loss
24.4 Magnet design and analysis
24.5 Electrical Insulation materials and systems
24.6 Measurement techniques
31. Electronic Devices and Circuits
31.1 Josephson Junctions
31.2 Digital Circuits
31.3 Analogue Circuits
31.4 Quantum Information Processing
31.5 Microwave Devices
31.6 Other Devices and Applications
31.7 Electronic Device Fabrication
33.1 SQUIDs and SQIFs; Design and Fabrication
33.3 Applications and Systems
Oral and posters
When submitting an abstract, please specify your preference, either for an “oral” or “poster” contribution. The “I have been invited” selection is for those already in receipt of an invitation from the programme committee.
A number of high quality submitted contributions will be elevated to the status of invited talk.
Notifications of acceptance or rejection of the abstract after review by the Program Committee will be communicated to the authors by mid-May 2019.
Contact information is required for all authors. The person submitting the abstract need not be the presenting author. Every contribution needs to indicate which author will be the associated registered delegate at the conference. Each delegate may only take this role for one abstract.
EUCAS 2019 will lead to two separate publications for work presented at the conference: Journal of Physics: Conference Series (JPCS), a peer-reviewed, open-access journal from Institute of Physics Publishing (UK) and a Special Issue of Superconductor Science and Technology (SUST) which is an international, multidisciplinary journal on all aspects of superconductivity (subject to SUST refereeing).
Details on publications and eligibility are available here.
On behalf of the Organising Committee and the Program Committee, we are looking forward to welcoming you to Glasgow in 2019.
John Durrell and Robert Hadfield, Conference Co-Chairs
Damian Hampshire, International Program Committee Chair
Yifeng Yang, Large Scale Chair Susie Speller, Materials Chair
Paul Warburton, Electronics Chair Ed Romans, Publication Chair